Hong Kong – Global communications agency Burson has announced the appointment of Simeon Mellalieu as its new CEO for Hong Kong, effective October 2, 2024.
Mellalieu brings 25 years of experience advising multinational companies on national, regional, and global communication strategies designed to build brands and safeguard reputations.
Throughout his career, Mellalieu has managed an extensive portfolio of clients across diverse sectors, including fast fashion, semiconductors, automotive, gaming, travel and leisure, enterprise and consumer technology, food and beverage, and banking and payments. He is also a dedicated supporter of academic and trade organisations throughout Hong Kong and the broader APAC region.
Notably, Mellalieu served as a board member and Chairman of PR Hong Kong (formerly the Council of PR Firms of Hong Kong) from 2010 to 2013. Before joining Burson, he was a partner for client development at Ketchum Asia-Pacific and managing director of Ketchum Hong Kong.
HS Chung, CEO for North APAC at Burson, said, “We are delighted to welcome Simeon to our APAC leadership team. Hong Kong remains a critical regional hub for Asian companies seeking to build their reputation on the global stage. Simeon’s extensive experience will help us further bolster our ‘Asia Going Global’ offer in Hong Kong, helping clients navigate pivotal market changes and seize opportunities, both in the region and abroad.”
Mellalieu began his communications career in the UK and has spent over two decades in Hong Kong. Before joining Ketchum, he worked at Bulletin International in London and Warman & Bannister in Cambridge.
Speaking about his appointment, Mellalieu shared, “This is an incredibly exciting and important moment in time to be joining Burson. We have a large and extremely talented team in Hong Kong supported by a powerful global network. I’m looking forward to working alongside my new colleagues locally and internationally to build our leading position in the industry based on innovative solutions, cut-through creativity, and incisive technology.”
